A group led by Cambridge University has developed a glue-free method for binding ultra-thin Galliumarenide sun cells to borosilicate glass. The proposed technology is reportedly compatible with standard flat device processing.
A team of researchers led by the UK’s University of Cambridge has developed a glue -free method to bind ultradoh -thun galliumarenide (mesh) solar cells to borosilicate glass. The technology, based on anodic bonding, offers a higher specific capacity for radiation protection in space emissions.
“Previous authors have demonstrated bound thin solar cells with light management with the help of adhesives; however, these materials are not fully compatible with standard flat device processing,” the team said. “That is why the development of a method for binding Ultradunne III-V solar cells to thermal expansion (CTE)-cut substrates is an important target for future applications of Ultradun III-V solar cells in space.”
To create their cells, the team started growing mesh layers with the help of molecular bundelitaxy (MBE), followed by removing their native oxides. By placing it on borosilicate glass, the binding process is started. It is executed in a binding chamber, which is heated to a maximum of 300 ° C, with a pressure of approximately 105 PA. Under these circumstances, a high voltage of up to 500 V is used, so that the device connected to the glass.
“The Borosilicate Glass used was D263 T Eco van Schottt, which has a CTE of 7.20 × 10 c -1, closely agreed with that of mesh at raised binding temperatures. It was found that this CTE -Matching was essential for tribe management during the binding,” the researchers explained, “explained the researchers,” explained the investigations, “explained the investigations,” explained “patting,” explained, “the patting,” explained, ” Borofloat 33 Glass used, which has a CTE mistress for mesh. This resulted in considerable cracks because the bound stack cooled into room temperature, despite the use of relatively low binding temperatures that minimize thermal expansion. “
Image: University of Cambridge, Solar Energy Materials and Solar Cells, CC by 4.0
After the completion of the binding process, the growth wafer is removed by mechanical rags and chemical etchings. A titanium/golden layer was then thermally evaporated on the contact layer of the P-Type mesh. A nickel-golden metal ring contact was deposited in the area outside the Mesa. This structure makes integrated light management possible for substrate, Superstrraat or BI-facial orientations of the solar cells.
“In the implementation form of the glass-axis-susper streets, the maximum power density (PMAX) reaches the remaining factor 0.86 after exposure to electrons of 1 MEV with a fluence of 3.6 × 1016 cm-2, equivalent to> in a geostational orbit (geo-junction), which are displayed of the current commercial travel-junction, the current traveler-junction, the current traveler-junction). Short-circuit current density (JSC) of the Ultradunne Gaas sun cells with only 80 Nm thick Absorbers could be increased to 17.69 Mon/cm2 using higher BandGAP III-V alloys such as contact and binding strokes, with further improvement of the integration of advanced light management colleagues. “
In addition, the researchers have emphasized that the remaining factors of PMAX for both substrate and superstrom orientations are higher than those of commercial triple solar cells for space applications under 1 MEV electron radiation.
Their findings were presented in “Radiation resilient ultra-thin mesh solar cells on glass transferred by anodic binding“Published in Solar energy materials and solar cells. Researchers from the University of Cambridge in the United Kingdom, the Japanese Institutes for Quantum Science and Technology (QST), Tohoku University, the Japan Aerospace Exploration Agency (Jaxa) and Sanjo City University have conducted the study.
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