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Home - Solar Industry - Autowell -Technology reveals 0BB tool for multiple Silicon PV module technologies
Solar Industry

Autowell -Technology reveals 0BB tool for multiple Silicon PV module technologies

solarenergyBy solarenergyMarch 12, 2025No Comments3 Mins Read
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The equipment with a processing speed of up to 10,800 PCs/h can be used to upgrade the existing Super Multi-Busbar (SMBB) and Multi-Busbar (MBB) equipment made by the China-based Wuxi Autowell Technology (ATW). It is suitable for tunneloxide-passivated contact (Topcon), Heterojunction (HJT) and Back-contact (BC) Celt technologies.

March 12, 2025
Valerie Thompson

The China-based manufacturer of solar PV equipment, Wuxi Autowell Technology (ATW), has launched a bus barless or zero-busbar (0BB), Stringer that is suitable for new and existing customers. It is designed to te Legacy ATW Super Multi-Busbar (SMBB) and Multi-Busbar (MBB) production lines afterwards afterwards.

Indeed, the newest customer, a manufacturer of 10 GW Silicon Heterojunction (HJT), uses the technology to upgrade a legacy interconnect process described by ATW in a explanation as a “welding prior to glue print” workflow.

ATW noted that the 0BB technology has developed, which is compatible with tunneloxide-passivated contact (Topcon), HJT and Back-contact (BC) cell technologies, since 2021. It contains more than 120 patents for its 0BB tool, which was commercialized in 2024.

The decision to accept 0BB is powered by the need to reduce silver consumption while retaining a high yield. “For cell producers, reducing silver paste reduces production costs by 10% – it is a crucial factor in the current competitive solar market,” said a spokesperson for ATW told PV Magazine. “On the module side, it minimizes the optimized power collection path with finer threads of resistance losses that stimulate the output.”

The 0BB equipment is used for cells that vary in size from 156 mm to 230 mm, which are processed at a speed of up to 10,800 PCs/h. String lengths can be a maximum of 1,250 mm, with adjustment for other available sizes. The laser power of the cut groove is 50 W, while the heating laser is 300 W. The average power of the tool is 55 kW and 80 kW peak. It measures 10,750 x 2,500 x 2,650 mm.

See also  New technology to reduce oxygen defects in Czochralski wafers – SPE

The equipment supports workflows “glue application followed by curing”, as well as “welding prior to glue application and curing” workflows. It is compatible with UV-switchable and epoxy-based glue systems. Inspection is switched on by CCD cameras (CCD) cameras (CCD). Strip, string and electroluminescence (EL) inspection equipment is optional.

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