Researchers in Turkey tested a new cooling body design to cool insulated port bipolar transistor (IGBT) Arrays in tanning. They discovered that it reduced modulet temperatures with more than 6 ° C in laboratory experiments.
Researchers from the Manisa Celal Bayar University in Turkey have suggested using an aluminum cooling body (HS) of the peeled type to cool isolated port bipolar transistor (IGBT) Arrays in Solar PV-Omsorters.
In the study “Evaluation of the thermal performance of vapor rooms Integrated torn VIN Cool body for PV-Inverterkoeling Multiple source condition“Which was recently published in Case studies in Thermal EngineeringThe scientists explained that IGBT modules are responsible for around 55% of the malfunctions in semiconductor devices because of the heat they generate. “IGBT modules in the inverter are considered heat sources with high heat flux (16.29 W/cm2), “They specified.
In comparison with traditional HSS, the HS of the Skive Type offers a higher Vin height / GAP ratio, which defines the ratio Between the height of the fins and the distance between them. In the proposed system configuration, the vapor rooms (VCs) are integrated into the torn HS with a high aspect ratio of 20, which is said to reduce the resistance of the heat dissipation. In conventional HSS, the aspect ratio is usually up to 10.
The VCs use water as a work fluid and are made with a closed copper envelope and a sintered copper line structure.
“The working liquid evaporates due to the use of heat on the evaporator side of the VC,” the academics explained further. “The evaporated liquid fills the top core and condenses over the upper plate. The wont structure retreats the condensate to the evaporator part by capillary forces. The evaporation of closed loop and condensation results in very high thermal conductivity values.”
To analyze the cooling performance of the new HS, the research team considered that parameters such as the Fin -distance, thickness and aspect ratio considered. The isotrope and orthotropic thermal conductivity models also used to perform a series of numerical simulations.
The analysis showed that, thanks to the presence of the VCs, The maximum temperature of the IGBT module can be reduced by approximately 6.63 ° C for an inlet air speed of 7.5 m/s.
The researchers also discovered that the VCs help reduce the maximum surface temperature with the thickness of the base plate. The critical aspect ratio (height/distance) value for the torn HS is obtained as 20, and there is no significant effect on the temperature drop due to increasing aspect ratio after 20“They added.
Specific information about potential production costs or cost increases compared to conventional cooling for PV -Omsorers was not provided in the research work.
“It can be concluded that the torn HS with VC help promises a better cooling potential for powerful electronics equipment compared to conventional HSS,” the academics concluded. “Moreover, the optimization of the torn type HS can be realized in future works under natural convection conditions.”
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