The Michigan-based manufacturer supplies solar polysilicon used in the production of monocrystalline blocks and wafers used in solar cells.
The U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities (CHIPS and Science Act).
Hemlock Semiconductor is one of the few U.S.-based manufacturers of hyperpure polysilicon for the semiconductor and solar industries. Earlier this month, REC Silicon, a potential leader in polysilicon manufacturing, announced that this is the case discontinuation of polysilicon production at the plant in Moses Lake, Washington, which produced polysilicon used in solar energy production.
The award to HSC is intended to support the construction of a new manufacturing facility in Hemlock, Michigan, that will produce polysilicon for both the semiconductor and solar industries.
HSC’s hyper-pure polysilicon is used in the production of ultra-low carbon solar panels, allowing solar developers and owners to reduce embodied carbon by up to 50%, the company said.
The new facility is expected to create approximately 180 manufacturing jobs and more than 1,000 construction jobs over time.
“Hemlock is a global leader and the only American-owned company making hyper-pure polysilicon, a critical material in everything from phones to appliances and cars,” said Governor Whitmer. “By making it here in Michigan, we are bringing the supply chain home, saving manufacturers money and creating game-changing opportunities for our employees.”
The bipartisan CHIPS and Science Act was signed into law in 2022. The $52 billion investment was aimed at revitalizing the domestic semiconductor industry and making it less dependent on foreign imports, while creating jobs.
Funding will be distributed for capital expenditures based on the completion of construction, manufacturing and commercial milestones. The program will track the performance of each CHIPS Incentives Award through financial and programmatic reports, in accordance with the terms and conditions of the award.
The award follows the previously signed preliminary memorandum of conditions, announced in October 2024, and the completion of the ministry’s due diligence. Visit CHIPS for America for more information about the award website.
HSC began operations in 1961 and is owned by Corning Incorporated and Shin-Etsu Handotai.
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